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NUMERICAL SIMULATION OF HEAT TRANSFER IN DIRECTIONAL SOLIDIFICATION PROCESS FOR POLYCRYSTALLINE SILICON
Autori: Guoqiang Lv, Wenhui Ma, Hua Wang, Xiangyang Mei, Kuixian Wei
Data aparitiei: Iunie 2011
Revista: Environmental Engineering and Management JournalVol. 10Nr. 6
Pret: 25.00 RON    
N.A.
Temperature distribution in the vacuum directional solidification system influenced seriously on the impurities concentration and
microstructure in Polycrystalline Silicon. In this study, a numerical model for the transient global heat transfer for direction
solidification process has been developed by the finite element method (FEM). A two-dimension numerical simulation for
temperature distribution of directional solidification process was carried out using software Multi-physics Comsol 3.5a. The
results showed that temperature distribution was dependent on withdrawing velocity and solidification fraction and the slope of
the isothermal lines in the melt at withdrawing velocity 0.01mm/s was larger than that at withdrawing velocity 0.005mm/s under
the same position of the crucible. The measuring points of temperature in the solidification system were compared with that of the
calculation predictions.


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